CHIPF The 2012 Beijing international packaging fair summary
Our fair
2012 CHIPF will choose "Better Packaging, More Success" as a theme. The exhibition will focus on packaging design, new packaging materials application, simple packaging concept, packaging recycling and packaging security. In the meanwhile, 2012 CHIPF will inherit good trend that international exhibitors were interested in 2010 CHIPF, broaden international ......
Famous companies
Link