The first 2010 Beijing International Packaging Fair （Hereinafter referred to as CHIPF）has been closed successfully on June 4, 2010. As a comprehensive packaging exhibition firstly hosted by China Packaging Federation, it has been supported by exhibitors, visitors and local governments and has impacted a lot upon packaging industry. Two-year term CHIPF has made a figure and had a huge influence in world packaging industry, which is interdependent with exhibitors and visitors. In the following preparation period, the organizer will continue to innovate and make the next exhibition more successful.
